Yanfeng Lao is R&D Manager at Hisense Photonics Inc with many years’ experience in optoelectronic material and device researches, specialized in semiconductor lasers and photodetectors. He received Ph.D. degree in microelectronics and solid-state electronics from Shanghai Institute of Microsystem and Information Technology, CAS, China, where he has focused on developing 1310-nm Vertical-Cavity Surface-Emitting Lasers. He was a researcher with the Department of Physics and Astronomy, Georgia State University working on III-V material research and photodetector development. At Hisense Photonics, he has been involved with developing R&D laser projects including new product design and process development, as well as transitioning the project from R&D phase into mass production. His specialties include III-V epitaxy (MBE), design of device structure and process flow, and material & device characterizations.
Hisense Photonics Inc. is a high-tech chip design and manufacturing company in South Plainfield, New Jersey. We offer a full portfolio of uncooled 1310 nm and 1550 nm laser products utilizing in-house FP, DFB, EML, Tunable DBR, Tunable EML chips, etc., reaching speeds up to 25/56 Gps. We have fully integrated manufacturing model that enhances product reliability, manufacturability and performance, and control all phases of the development and manufacturing process in-house, spanning from device design & simulation to MOCVD epitaxy, full III-V wafer processing lines, and highly automated packaging techniques and a robust final testing platform.
Hisense Photonics manufactures key innovative in-house technologies, which ensure our position as an optoelectronics industry leader. Our proven modular technology platforms, supported by a library of patents, ensure that each of our products have been designed to provide the most advance and competitive optical solutions for today’s Fiber-To-the-Home (FTTH), Cable Television, Data Communications Network and Consumer Electronics markets. Our technical mandate is to simplify our customer’s increasingly complex optical communications challenges through functional and monolithic integration.